UltraMemory Turns to NanoSpice, NanoSpice Giga From ProPlus Design Solutions for Design of Super-Broadband, Large-Scale Memory
SAN JOSE, CA--(Marketwired - May 24, 2016) -UltraMemory Inc. (UltraMemory) has selected NanoSpice™ and NanoSpice Giga™ from ProPlus Design Solutions, Inc., the leading technology provider of giga-scale parallel SPICE simulation, SPICE modeling solutions and Design-for-Yield (DFY) applications, to simulate its super-broadband, super large-scale memory design.
UltraMemory is developing innovative 3D DRAM chip, which includes Through Chip Interface (TCI), enabling low-cost and low-power wireless communication between stacked DARM when compared to TSV technology.
Highly accurate and high-capacity SPICE simulation was necessary because it needed to simulate several DRAM chips with analog functions. UltraMemory's decision to adopt NanoSpice, a high-performance parallel SPICE simulator, and NanoSpice Giga, the industry's only GigaSpice simulator, came after an extensive evaluation of commercial SPICE and FastSPICE circuit simulators. NanoSpice and NanoSpice Giga have been integrated in UltraMemory's existing design flows to replace other SPICE and FastSPICE simulators to provide full circuit simulation solutions from small block simulation to full-chip verification.
NanoSpice was validated for its high-accuracy, fast simulation speed and analysis feature compatibilities. NanoSpice Giga proved itself to be a worthy replacement to FastSPICE with a pure SPICE engine for higher accuracy, and advanced parallelization technologies for superior performance and giga-scale simulation features. Its usability removed the UltraMemory user's need to operate complicated FastSPICE options and tuning.
By fully leveraging the computation power of advanced multi-core servers and offering a unique license model, ProPlus simulation tools offer several times higher simulation performance or throughput than other circuit simulators with the same level of investment in hardware and software licenses.
"UltraMemory aims to improve the performance of the next-generation computer system by developing the super-broadband and super-large scale memory," says Mr. Takao Adachi, President and Chief Executive Officer (CEO) of UltraMemory Inc. "As a result, we have very high standards for simulation accuracy and performance for our large scale memory designs. ProPlus' NanoSpice and NanoSpice Giga were selected as total circuit simulation solutions in our design flow. They have proven to be accurate and fast, delivering impressive simulation throughput and unique advantages with their pure SPICE simulation engines for all our advanced memory design needs."
"UltraMemory has a great vision for developing leading-edge memory for its next-generation computer system," remarks Dr. Zhihong Liu, ProPlus' chairman and CEO. "We welcome the opportunity to be part of this important project. NanoSpice and NanoSpice Giga fit this opportunity with their full range of simulation capacities from small blocks to full chip SPICE-accurate simulation power, and can help achieve goals that would be difficult to reach without our circuit simulation solutions."
ProPlus will demonstrate NanoSpice and NanoSpice Giga, along with its new ME-Pro™ process and device evaluation tool, during the Design Automation Conference (DAC) in Booth #1219 Monday, June 6, through Wednesday, June 8, from 10 a.m. until 6 p.m. DAC will be held at the Austin Convention Center, Austin, Texas.